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Hermetic package for optical MEMS

Publications associées (34)

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Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

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High-speed signaling over package substrates is key to delivering the promise of 2.5D integration. Applications abound and include high-density memory interfaces, sub-division of large dies to increase yield and lower development time, sub-division of a di ...

2016

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

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This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Reliability Aspects of Microelectromechanical Systems for Space Applications

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

3D-Integration of a Carbon Nanotube based RF-NEMS

Rokhaya Gueye

In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...

EPFL2013

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An implantable biosensor array for personalized therapy applications

Andrea Cavallini

At present, most of the tests involved in personalized medicine are complex and must be conducted in specialized centers. The development of appropriate, fast and inexpensive diagnostic technologies can encourage medical personnel in performing preventive ...

EPFL2013