Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications
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Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...
Wireless communication systems and handset devices are showing a rapid growth in consumer and military applications. Applications using wireless communication standards such as personal connectivity devices (Bluetooth), mobile systems (GSM, UMTS, WCDMA) an ...
Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 μm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ...
Interlayer cooling is the only heat removal concept which scales with the number of active tiers in a vertically integrated chip stack. In this work, we numerically and experimentally characterize the performance of a three tier chip stack with a footprint ...
A highly sensitive photo-detector array deposited on a glass substrate with an optional integrated optical filter have been presented. The active element is a vertically integrated hydrogenated amorphous silicon photodiode featuring a dark current of less ...
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We report on the first successfully microfabricated and tested ion-implanted dielectric electroactive polymer (EAP or DEAP) actuators. Dieletric EAP (DEAP) actuators combine exceptionally high energy-density with large amplitude displacements [1,2]. Scalin ...