Correlation of microstructural and mechanical properties in particle reinforced lead-free solders
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Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...
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We explore the influence of the metal microstructure on the compressive flow stress of replicated microcellular 400-mu m pore size Al-4.5 wt%Cu solidified at two different solidification cooling rates, in the as-cast and T6 conditions. It is found that the ...
New data are presented on dynamic measurements of elasticity and anelasticity of several poly- and single crystalline Ni1+xTi1-x alloys for frequencies between 0.05 and 100 kHz over a wide temperature range below room temperature. Anelastic effects, previo ...
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