Correlation of microstructural and mechanical properties in particle reinforced lead-free solders
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the ...
We investigate processing-microstructure relationships in the production of Al2O3 particle reinforced copper composites by solidification processing. We show that during production of the composites by gas-pressure infiltration of packed Al2O3 particle pre ...
The effect of temperature on the crack onset strain (COS) of brittle coatings on polymer substrates was investigated through a series of temperature-controlled tensile tests carried out in situ under an optical microscope. It was observed that the failure ...
This research project experimentally and numerically investigates the growth and coalescence of pre-existing voids for a wide range of stress states in a ductile matrix with a special focus on shear dominated loading conditions and presents quantitative ki ...
The tensile properties of the high-chromium tempered martensitic reduced activation steel Eurofer97 were determined from tests carried out over a wide range of strain-rates on cylindrical specimens. The quasi-static tests were performed with a universal el ...
This work compares the time dependence of isothermal shape recovery in thermoset and thermoplastic shape memory polyurethanes (SMPUs) with comparable glass transition temperatures. In each case, tensile tests have been used to quantify the influence of var ...
Organosilicate glasses (OSGs) are used as low-k intermetal dielectrics for advanced integrated circuits. In this application, the material must fulfill two conflicting requirements: It has to have low density to reduce the dielectric constant while being s ...
Open-pore replicated microcellular 99.99% pure aluminium is tested in tensile creep, varying the temperature from 150 to 450 degrees C, the applied stress from 0.15 to 0.5 MPa, and the relative density from 0.14 to 0.28. Tensile creep curves are of classic ...
Zinc oxide nanostructured thin films are transparent semiconducting ceramics increasingly used in a wide range of integrated devices. This paper outlines a simple strategy to integrate arrays of zinc oxide nanostructured thin films on elastomeric substrate ...
Welding is an important joining method for the work with metals. During the welding process, the material is heated and deforms plastically which leads a change in microstructure in the heat affected zone, to complex residual stress distributions, and dist ...
