Correlation of microstructural and mechanical properties in particle reinforced lead-free solders
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For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...
A 2-D numerical model for brittle creep and stress relaxation is proposed for the time-dependent brittle deformation of heterogeneous brittle rock under uniaxial loading conditions. The model accounts for material heterogeneity through a stochastic local f ...
Effects of non-uniform strains on tensile fracture of fiber-reinforced ceramic–matrix composites have not been satisfactorily explained by existing mechanics-based models. In this paper, we use an exact model of fiber fragmentation under global load sharin ...
The aim of the thesis is to obtain more understanding about the influence of plastic deformation on the microstructural changes observed in single crystal (SX) Ni-based superalloys using diffraction techniques. This work was organised around two main probl ...
In this work, we study the long-term mechanical strength under static load - i.e. static fatigue performance or resistance to subcritical crack growth - of ceramic thick-film circuits, namely how the static fatigue of the substrate is affected by the prese ...
In this work, we present a stress functions approach to include image effects in continuum crystal plasticity arising from the long-range elastic interactions (LRI) between the GND density and free surfaces. The resulting length-scale dependent internal st ...
Copper-based composites reinforced with alumina particles are produced by two different pro- cesses, namely gas pressure driven infiltration of a porous alumina preform and a two-step in-situ process developed in the course of this work. The resulting comp ...
The creep properties of a cast gamma-alpha-2 lamellar titanium aluminide of type Ti-46Al-2W-0.5Si (at. %) containing beta-particles was investigated using both helium-implanted and non-implanted material. Creep tests were performed in vacuum under constant ...
Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of ...
Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of ...
