Publication
0-level Vacuum Packaging RT Process for MEMS Resonators
Publications associées (34)
Printed and encapsulated environmental sensors on biodegradable polylactic acid (PLA)
Nico de Rooij, Danick Briand, Francisco Molina Lopez, Andres Felipe Vasquez Quintero, Alexis Pierre Henri Marette, Nathalie Frolet
We are dedicating efforts on the realization of smart packaging systems integrating environmental sensing capabilities based on plastic and printed electronics technologies. Here, we present the development, fabrication and characterization of printed gas ...
2014Packaging technologies for high temperature control electronics
Peter Ryser, Yusuf Leblebici, Thomas Maeder, Conor Joseph Slater, Radisav Cojbasic
Current low temperature electronics (175°C) for prolonge ...
IMAPS2013Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging
Nico de Rooij, Danick Briand, Yves Pétremand
This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...
Institute of Physics2013High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS
Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye
A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...
SPIE - International Society of Optical Engineering2013Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity
Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater
The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long periods ...
IMAPS / ACerS2012Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging
Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater
An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...
Trans Tech Publications2012Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging
Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater
An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...
Trans Tech Publications Ltd2012An analysis of destination choice for opaque airline products using multidimensional binary logit models
Michel Bierlaire, Alexandre Khelifa
We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...
Pergamon-Elsevier Science Ltd2012Vibration energy harvester on plastic foil based on transferring PZT thick sheets with dry film photoresist
Nico de Rooij, Danick Briand, Jinyu Jason Ruan, Andres Felipe Vasquez Quintero, Pattanaphong Janphuang, Robert Andrew Lockhart
This paper presents a low-complexity and low temperature (85°C) fabrication process for vibration energy harvesters. The process employs lamination steps to transfer thinned PZT thick sheets onto flexible polymeric substrates, using dry film photoresist. T ...
2012Foil level packaging of a chemical gas sensor
Nico de Rooij, Danick Briand, Jérôme Courbat
A generic method for the packaging of transducers at the foil level is proposed and was demonstrated on chemical gas sensors made on a plastic foil. The processing was based on the lamination of pre-patterned polymeric structures on the fabricated devices ...
Institute of Physics2010