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Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...
Copper and copper alloys typically experience a sharp loss in ductility at intermediate temperature, induced by grain boundary damage and fracture processes. The susceptibility of the material to intermediate temperature embrittlement is, as a result, stro ...
A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with Cu6Sn5 as the leading phase. Interestingly, two different eutectic morph ...
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...
Cu-Ni-Sn alloys with Pb additions exhibit high mechanical strength at room temperature coupled with good machinability but experience a significant ductility loss above the melting point of lead. We explore here the influence of minor additions of Al, Mn, ...
The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...
Alloys based on the Sn-0.7Cu-xNi system are potential Pb-free solders. In this paper we report on the solidification characteristics and microstructures of Sn-0.7Cu alloys containing 0-1,000 ppm nickel. The microstructural observations show that increasing ...
