Publication

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

Publications associées (36)

Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...

Elsevier2016

Solutions for thermally mismatched brazing operations for ceramic tokamak magnetic sensor

Duccio Testa, Peter Ryser, Matthieu Toussaint, Thomas Maeder, Caroline Jacq, Philipp Windischhofer, Xinyue Jiang

To monitor high-frequency fluctuations of the equilibrium magnetic field in tokamaks, a 3D magnetic sensor has been developed. The sensor, which is positioned inside the vacuum vessel behind the protective tiles of the tokamak and is exposed to potential t ...

2016

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

John Botsis, Joël Cugnoni, Milad Maleki

Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...

Springer2014

Utilisation de brasure sans plomb pour le capteur de force CentoNewton

Thomas Maeder, Ludivine Ammon

Ce rapport décrit les tests effectués sur des capteurs CentoNewton-B en cours de productions pilotes, dans le but d’utiliser à l’avenir de la brasure sans plomb. S'il est possible d'utiliser une composition conductrice argent peu allié (ESL 9562G) pour les ...

EPFL-LPM2014

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

John Botsis, Joël Cugnoni, Milad Maleki

The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of the whole solder. The main scope of this study is to deve ...

Elsevier2013

Interaction between liquid aluminium and solid iron Al-rich intermetallics formation

Guillaume Pasche

Intermetallic phases formation is one of the phenomena, which when coupled to thermal and mechanical strains leads to the premature wear of aluminium die casting tools made out of steel. This work focuses on two aspects of this wear problem. The first and ...

EPFL2013

Time-Resolved X-Ray Microtomography Observation of Intermetallic Formation Between Solid Fe and Liquid Al

Michel Rappaz, Cécile Hébert, Aïcha Hessler-Wyser, Guillaume Pasche

Time-resolved in situ X-ray tomography combined with scanning electron microscopy was performed on an Al-Fe diffusion system at 973 K (700 A degrees C) to study the formation of the main intermetallic compounds occurring at the interface. After nucleation ...

Springer US2013

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Christian Leinenbach, Shan Jin

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...

Springer2013

Deformation and Damage in Lead-free Solder Joints

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Soudure par interdiffusion dans les systèmes Au-In et In-Ni

Léa Deillon

Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...

EPFL2012

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