Improvement of elevated temperature mechanical properties of Cu–Ni–Sn–Pb alloys
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This paper describes the microstructure, tensile properties and Charpy impact resistance of a reduced activation oxide dispersion strengthened ferritic steel Fe-14Cr-2W-0.3Ti-0.3Y(2)O(3) produced by mechanical alloying of a pre-alloyed, gas atomised steel ...
The present study investigated the role of alloy microstructure and surface roughness on wear and friction behavior of leaded and unleaded tin bronzes. Ball-on-disk experiments were carried out under dry conditions with steel balls sliding against bronze d ...
Copper and copper alloys typically experience a sharp loss in ductility at intermediate temperature, induced by grain boundary damage and fracture processes. The susceptibility of the material to intermediate temperature embrittlement is, as a result, stro ...
Five ternary Sn-0.7Cu-xNi alloys with nickel contents in the range 0-1000 ppm have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites, eutectic and primary Cu6Sn5 is interpreted with phase ...
This thesis is an exploration of deformation and fracture properties of a novel two-phase α2 + γ Ti46Al8Ta (at.%) alloy featuring a "convoluted" microstructure, produced by partners within a European Union project named IMPRESS. Properties of this alloy ar ...
Ingots of an oxide dispersion strengthened reduced activation ferritic steel with the Fe-14Cr-2W-0.3Ti-0.3Y(2)O(3) chemical composition (in wt.%) were synthesized by mechanical alloying of elemental powders with 0.3 wt.% Y2O3 particles in a planetary ball ...
We show that steel-magnesium alloy laminated metal composites (LMCs) can be produced by gas pressure infiltration of a liquid magnesium alloy between layers of stacked dimpled steel sheets. Resulting LMCs are amenable to subsequent warm rolling. The LMCs a ...
As the upper temperature for use of reduced activation ferritic/martensitic steels is presently limited by a drop in mechanical strength at about 550 degrees C, Europe, Japan and the US are actively researching steels with high strength at higher operating ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
In liquid metal spallation targets such as the MEGAPIE (the megawatt pilot experiment) target and the future ADS (accelerator driven system) spallation targets, which utilize liquid lead-bismuth eutectic (LBE) as the target material, liquid metal embrittle ...