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Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Publications associées (37)

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Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

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Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...

IEEE2021

Diamond on GaN integration for power semiconductor devices with efficient thermal management

Reza Soleiman Zadeh Ardebili

The international actions against global warming demands reductions in carbon emission and more efficient use of energy. Energy efficiency in the conversion and use of electricity, as an important form of energy in the modern life, has strong environmental ...

EPFL2021

Novel pulsating heat pipe for high density power data centres: performance and flow regime analysis

John Richard Thome, Jackson Braz Marcinichen, Raffaele Luca Amalfi, Filippo Cataldo

With the advancement of technologies such as Artificial Intelligence and 5G telecommunications, where computational rate is constantly pushing its limits, highly efficient and reliable cooling devices are starting to become an overly critical factor. Not o ...

IEEE2021

Multi-physical characterization of cellular ceramics for high-temperature applications

Ehsan Rezaei

The use of cellular ceramics in enhancing the performance of a high-temperature latent heat thermal energy storage unit was investigated. A detailed design methodology is presented, which consists of a combined analytical-numerical analysis followed by a m ...

EPFL2020

Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components. One barrier to wide spread adoption of two-phase cooling solutions is preserving product features deemed essenti ...

IEEE2018

A transient thermal regime is achieved in glassy GeTe4 by first-principles molecular dynamics following the recently proposed ''approach-to-equilibrium'' methodology. The temporal and spatial evolution of the temperature do comply with the time-dependent s ...

Royal Soc Chemistry2017

Thermal Issues in Deep Sub-Micron FDSOI Circuits

Yusuf Leblebici, Can Baltaci

Self-heating effects became more prominent with the introduction of the modern devices like FDSOI and low thermal conductivity materials such as SiO2. Consequently, the design of high speed digital circuits which are the time-critical blocks of high perfor ...

Ieee2016

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Enhanced performance in AlGaN/GaN Schottky barrier diodes (SBDs) is investigated using a nanowire hybrid tri-anode structure that integrates 3-D Schottky junctions with tri-gate transistors. The fabricated SBDs presented an increased output current density ...

Institute of Electrical and Electronics Engineers2016