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Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

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System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Joshua Alexander Harrison Klein

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

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In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

2022

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The MALTA pixel chip is a 2 cm x 2 cm large monolithic pixel detector developed in the Tower 180 nm imaging process. The chip contains four CMOS transceiver blocks at its sides which allow chip-to-chip data transfer. The power pads are located mainly at th ...

ELSEVIER2022

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We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

2021

Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology

David Atienza Alonso, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, Mohamed Mostafa Sabry Aly, Halima Najibi

Deeply-scaled three-dimensional (3D) Multi-Processor Systems-on-Chip (MPSoCs) enable high performance and massive communication bandwidth for next-generation computing. However, as process nodes shrink, temperature-dependent leakage dramatically increases, ...

2020

In this paper, we describe a systematic low-power design methodology for technologies that offer a strong body factor. Specifically, we explore both the body bias voltage and the supply voltage knobs in order to find the MEP (minimum energy point) for a co ...

IEEE2019

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This paper presents DynOR, a 32-bit 6-stage OpenRISC microprocessor with dynamic clock adjustment. To alleviate the issue of unused dynamic timing margins, the clock period of the processor is adjusted on a cycle-by-cycle level, based on the instruction ty ...

Ieee2016

With the omnipresence of embedded processing in all forms of electronics today, there is a strong trend towards wireless, battery-powered, portable embedded systems which have to operate under stringent energy constraints. Consequently, low power consumpti ...

EPFL2016

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3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...

Elsevier2016

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015