Publication

Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips

Publications associées (36)

Experimental evaluation of the thermal performances of a thermosyphon cooling system rejecting heat by natural and forced convection

In the present paper, a closed-loop thermosyphon cooling system for power electronics has been developed and tested. The evaporator is a multi-microchannel heat sink designed for high heat fluxes. The power electronics module is emulated by four independen ...

Pergamon-Elsevier Science Ltd2017

Innovative low-mass cooling systems for the ALICE ITS Upgrade detector at CERN

Manuel Gómez Marzoa

The Phase-1 upgrade of the LHC to full design luminosity, planned for 2019 at CERN, requires the modernisation of the experiments around the accelerator. The Inner Tracking System (ITS), the innermost detector at the ALICE experiment, will be upgraded by r ...

EPFL2016

Two-Phase Heat Transfer Mechanisms within Plate Heat Exchangers

Raffaele Luca Amalfi

Plate heat exchangers are adopted in many domestic and industrial applications, such as ventilation, air conditioning, evaporation or condensation process, heat pumps and cooling of hydrodynamic circuits in engines. In the present thesis, an extensive expe ...

EPFL2016

Critical heat flux: Performance of R1234yf, R1234ze and R134a in an aluminum multi-minichannel heat sink at high saturation temperatures

John Richard Thome

In this paper, new saturated critical heat flux (CHF) values at medium-to-high saturation temperatures are presented for an aluminum multi-minichannel test section. Among the possible working fluids, R134a and the low GWP refrigerants R1234yf and R1234ze h ...

Elsevier France-Editions Scientifiques Medicales Elsevier2016

Two-Phase Mini-Thermosyphon Electronics Cooling, Part 3: Transient Modeling and Experimental Validation

John Richard Thome, Jackson Braz Marcinichen, Nicolas Lamaison, Chin Lee Ong

This paper is the third part of the present study on two-phase mini-thermosyphon cooling systems. As mentioned in the first two parts, gravity-driven cooling systems using microchannel flow boiling are a very promising long-term viable solution for electro ...

Ieee2016

Thermo-Hydrodynamics in a Closed Loop Pulsating Heat Pipe

Giulia Spinato

Pulsating heat pipes (PHPs) represent a promising solution for passive on-chip, two-phase cooling of micro-electronics, providing advantages such as a simple construction and operation in any gravitational orientation. Unfortunately, the unique coupling of ...

EPFL2014

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

John Richard Thome, Jackson Braz Marcinichen, Yassir Madhour, Brian Paul D'Entremont, Bruno Michel

Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...

American Society of Mechanical Engineers2014

Dynamic Modeling and Experimental Evaluation of a Controlled Two-Phase On-Chip Cooling System Designed for High Efficiency Datacenters

Nicolas Lamaison

An important challenge for the next generation of high performance datacenters is to guarantee sufficient, reliable, green and cheap cooling of the server blades. Since this seems unrealistic with air cooling technologies due to the expected ever higher ch ...

EPFL2014

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

David Atienza Alonso, John Richard Thome, Arvind Raj Mahankali Sridhar, Yassir Madhour

Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

IEEE/ACM Press2013

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