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Effect of low-temperature processing on dry film photoresist properties for flexible electronics

Publications associées (34)

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Packaging technologies for high temperature control electronics

Peter Ryser, Yusuf Leblebici, Thomas Maeder, Conor Joseph Slater, Radisav Cojbasic

Current low temperature electronics (175°C) for prolonge ...

IMAPS2013

Helium embrittlement of a lamellar titanium aluminide

Philippe Spätig, Per Magnusson

Embrittlement by helium was investigated in a lamellar TiAl alloy under two conditions: Specimens were implanted to various amounts of helium up to 762 appm at temperatures from 630 °C to 1000 °C and some of them subsequently creep-tested at the same tempe ...

Elsevier2013

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

Review of Bi2O3-based glasses for electronics and related applications

Thomas Maeder

The present work critically reviews the scientific and patent literature on low-melting bismuth-based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, ...

Maney Publishing2013

When a tetrathiofulvalene (TTF) crystal is placed onto a 7,7,8,8‐tetracyanoquinodimethane (TCNQ) crystal at room temperature, a highly conducting layer is formed. In this study, we explore to what degree this is due to physical contact or transfer by subli ...

2012

Critical mechanical and electrical transition behavior of BaTiO3: The observation of mechanical double loop behavior

Dragan Damjanovic

Strain response of polycrystalline barium titanate (BaTiO3) was investigated under high unipolar electric field (0 to 4 kV/mm) and compressive stress (0 to 400 MPa) in the temperature range from 25 to 160 degrees C. In the vicinity of the Curie point (T-C) ...

American Institute of Physics2012

A spinning thermometer to monitor microwave heating and glass transitions in dynamic nuclear polarization

Geoffrey Bodenhausen, Sandrine Gerber, Pascal Miéville, Sami Jannin, Marc Anthony Caporini

As previously demonstrated by Thurber and Tycko, the peak position of Br-79 in potassium bromide (KBr) allows one to determine the temperature of a spinning sample. We propose to adapt the original design by using a compact KBr tablet placed at the bottom ...

Wiley-Blackwell2011

The use of the structural adhesive bonding technique is well established in the aircraft and automotive industries where, in most cases, joints can be fabricated indoors under controlled conditions. In the civil engineering domain, however, load-bearing st ...

EPFL2011

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The effect of temperature on the crack onset strain (COS) of brittle coatings on polymer substrates was investigated through a series of temperature-controlled tensile tests carried out in situ under an optical microscope. It was observed that the failure ...

Elsevier2011

A high penetration grade bitumen has been blended with up to 50 wt% of two different grades of metallocene catalyzed linear low density polyethylene (m-LLDPE) in order to investigate the potential of these and similar copolymers as a substitute for styrene ...

Springer US2011