Improved test setup for MEMS mechanical strength investigations and fabrication process qualification
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This article presents a triaxial micro electromechani-cal system (MEMS) capacitive accelerometer using a high-voltage biasing technique to achieve high resolution with ultralow power. The accelerometer system generates a differential pair of high voltages ...
In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...
Electro-optical photonic integrated circuits (PICs) based on lithium niobate (LiNbO3) have demonstrated the vast capabilities of materials with a high Pockels coefficient1,2. They enable linear and high-speed modulators operating at complementary metal–oxi ...
Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...
During this project, the microfabrication of Hafnium Carbide (HfC) was investigated. Multiple tools were considered and tested for their compatibility and effectiveness when working with HfC. The main method of choice for the machining of HfC thin films wa ...
This work extends the range of pathways for the production of metallic microcomponents by downscaling metal casting. This is accomplished by using either of two different molding techniques, namely femtosecond laser micromachining or lithographic silicon m ...
The field of micro electromechanical systems (MEMS) evolved from the microelectronic industry and the technologies developed to fabricate integrated circuits. As a result, MEMS are commonly fabricated on silicon wafers. The development of MEMS has been dri ...
Fatigue damage in materials results in localized strain at the microstructural level. In many engineering components of the cooling circuits of nuclear power plants, where austenitic steels are used, the material experiences multiaxial cyclic loading, eith ...
Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...
Combining optical gain in direct-bandgap III-V materials with tunable optical feedback offered by advanced photonic integrated circuits is key to chip-scale external-cavity lasers (ECL), offering wideband tunability along with low optical linewidths. Exter ...