Qualitative link between work of adhesion and thermal conductance of metal/diamond interfaces
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Aluminum nitride (AlN) has been applied to various applications, including electronic substrates and packaging, semiconductor production components, wide band gap semiconductor, light-emitting diodes (LED) and acoustic wave devices; at the same time, it is ...
The influence of sample processing parameters on the thermal boundary conductance (TBC) between aluminum and aluminum nitride has been investigated by transient thermoreflectance. An evaporated Al layer on the polished substrate yielded a TBC at ambient of ...
An experimental thermal characterization method is developed for high thermal conductivity thin films. The method utilizes Ta/Pt resistors on microfabricated free-standing thin film structures both for heating and temperature monitoring at different positi ...
Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2009
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by gas pressure infiltration into diamond powder beds with the aim to maximize thermal conductivity and to explore the range of coefficient of thermal expansion ...
Trans Tech Publications Ltd, Laublsrutistr 24, Ch-8717 Stafa-Zurich, Switzerland2009
Diamond tips are attractive tools for nanoscience because of their hardness and, when doped chemical vapor deposited (CVD) diamond is used, their electrical conductivity. In this article, devices based on CVD diamond coated silicon tips and molded diamond ...
The inertness and unique electrochem. properties of diamond present great potential for a variety of applications in aggressive environments. Preliminary results showed the widest known electrochem. window before water decompn., allowing new possibilities ...