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Conductive nanocomposites have emerged as significant smart engineered materials for realizing flexible electronics on diverse substrates in recent years. Conductive nanocomposites are comprised of conductive fillers mixed with polymeric elastomer (e.g. po ...
The strong interaction between Electronic Design Automation (EDA) tools and Complementary Metal-Oxide Semiconductor (CMOS) technology contributed substantially to the advancement of modern digital electronics. The continuous downscaling of CMOS Field Effec ...
Stretchable electronics are integrated circuitry that can reversibly expand and relax while retaining their functionality. This emerging technology has great potential in unconventional electronic application areas, especially in biomedical sector. To atta ...
The Hall cells intended for industrial applications are mainly produced in silicon integrated circuit technology. Recently, the increased use of other technologies, such as GaAs, InAs and InSb, have been reported. However, a single chip solution comprising ...
Czech Technical University in Prague, Faculty of Electrical Engineering2012
This work presents three applications of dry photoresist film for printed and flexible electronics devices. First, as part of the flexible encapsulation of printed gas sensors (i.e. humidity). This process was performed at relatively low temperatures (85 ° ...
Organic thin-film transistors (TFTs) have undergone tremendous progress in the past few years. Their great potential in terms of mechanical flexibility, light weight, low-cost and large-area fabrication makes them promising candidates for novel electronic ...
Low Temperature Co-fired Ceramics (LTCC) is one of the microelectronic techniques. This technology was initially developed as an alternative to Printed Circuit Boards (PCB) and classical thick-film technology, and it has found application in the fabricatio ...
In this project, a resonator was theoretically defined and modelled in an effort to choose appropriate impedance matching between the resonator and outside electronics. Quite Universal Circuit Simulation (QUCS) was used to model the S-parameter of potentia ...
This paper introduces a new integration technology for cost-effective high-precision mechanical and electrical integration of mesoscopic functional foil components onto foil substrates. The foil-to-foil assembly process is based on topological surface stru ...
Institute of Electrical and Electronics Engineers2015
This paper represents the extended version of the conference paper “Developing highly-integrated subcutaneous biochips for remote monitoring of human metabolism” pre- sented at the IEEE Sensors Conference 2012, and presents data on assembly, packaging and ...
Institute of Electrical and Electronics Engineers2015