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A detailed analysis of the cross-like Hall cells integrated in regular bulk CMOS technological process is performed. To this purpose their main parameters have been evaluated. A three-dimensional physical model was employed in order to evaluate the structu ...
Thermal behaviours of high-performance digital circuits in bulk CMOS and FDSOI technologies are compared on a 64-bit Kogge-Stone adder designed in 40nm CMOS node. Temperature profiles of the adder in bulk and FDSOI are extracted with thermal simulations an ...
Routing multiplexers based on pass-transistors or transmission gates are an essential components in many digital integrated circuits. However, whatever structure is employed, CMOS multiplexers have two major limitations: 1) their delay is linearly related ...
Semiconductor device research for digital circuit design is currently facing increasing challenges to enhance miniaturization and performance. A huge economic push and the interest in novel applications are stimulating the development of new pathways to ov ...
Field Programmable Gate Arrays (FPGAs) have been indispensable components of embedded systems and datacenter infrastructures. However, energy efficiency of FPGAs has become a hard barrier preventing their expansion to more application contexts, due to two ...
During the last decades, the usage of silicon photodetectors, both as stand-alone sensor or integrated in arrays, grew tremendously. They are now found in almost any application and any market range, from leisure products to high-end scientific apparatuses ...
The strong interaction between Electronic Design Automation (EDA) tools and Complementary Metal-Oxide Semiconductor (CMOS) technology contributed substantially to the advancement of modern digital electronics. The continuous downscaling of CMOS Field Effec ...
The increasing impact of variability on near-threshold nanometer circuits calls for a tighter online monitoring and control of the available timing margins. Error-detection sequentials are widely used together with error-correction techniques to operate di ...
Self-heating effects became more prominent with the introduction of the modern devices like FD-SOI and low thermal conductivity materials such as SiO2. Consequently, the temperature rise of a device due to its self-heating is pronounced more as the gate le ...
Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...
