Determination of crystal growth rates during rapid solidification of polycrystalline aluminum by nano-scale spatio-temporal resolution in situ transmission electron microscopy
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Xu et al. have recently published a set of results for boiling heat transfer measurements in a multi- channel micro- scale evaporator for flow boiling of acetone in triangular cross- section channels ( hydraulic diameter of 155.4 mm). In the present collab ...
Experimental condensation heat transfer data for the new refrigerant R1234ze(E), trans-1,3,3,3-tetrafluoropropene, are presented and compared with refrigerants R134a and R236fa for a vertically aligned, aluminum multi-port tube. Local condensation heat tra ...
Heat transfer coefficients for enhanced tubes are typically measured indirectly using the "Wilson plot" method to first characterize the thermal performance of the one side (heating or cooling supply) and then to obtain the heat transfer data for the enhan ...
Nowadays, the production in fine chemical and pharmaceutical industry is mostly carried out in large scale batch reactors having typically dimensions of a few meters to satisfy the demand of the market. Even though this technology has been widely used and ...
This work consists in an experimental study of the main parameters governing the transport of heat across an interface between two solids, when it is dominated by phonons. The main experimental tool used is Time-Domain ThermoReflectance (TDTR), which is an ...
Described is a method of manufacturing a module with long-term stability even though it contains a non-heat-resistant material, in particular a photosensitizer. Two glass plates (1, 2) are connected to each other round their edges with an edge-sealing stru ...
The paper presents a comparison of transient calculations for two 80-MWt MOX-fuelled experimental accelerator-driven systems (XADS), one cooled by lead-bismuth eutectic and the other by helium. The results for protected (with accelerator beam trip) and unp ...
Power Electronic components require cooling to limit junction temperatures to ensure long and reliable operation. Heat sinks are used for cooling the components. In applications which entail operation at altitudes, derating factors are provided by manufact ...
A heat sink that is particularly suitable for semiconductor components is made from a diamond-containing composite material. In addition to a diamond fraction amounting to 40-90% by volume, the composite material also contains 7 to 59% by volume copper or ...
The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...