Low-Temperature Screen-Printed Metallization for the Scale-Up of Two-Terminal Perovskite-Silicon Tandems

Tandem photovoltaic devices based on perovskite and crystalline silicon (PK/c-Si) absorbers have the potential to push commercial silicon single junction devices beyond their current efficiency limit. However, their scale-up to industrially relevant sizes is largely limited by current fabrication methods which rely on evaporated metallization of the front contact instead of industry standard screen-printed silver grids. To tackle this challenge, we demonstrate how a low-temperature silver paste applied by a screen-printing process can be used for the front metal grid of two-terminal perovskite-silicon tandem structures. Small-area tandem devices with such printed front metallization show minimal thermal degradation when annealed up to 140 degrees C in air, resulting in silver bulk resistivity of

Passivating contacts for homojunction solar cells using a-Si:H/c-Si hetero-interfaces

Bénédicte Demaurex

Crystalline silicon (c-Si) homojunction solar cells account for over 90% of the current photovoltaic market. However, further progress of this technology is limited by recombinative losses occurring at their metal-semiconductor contacts. The goal of this thesis is to develop passivating contacts to resolve this issue. The novel idea presented in this work is to insert an ultra-thin wide bandgap semiconductor-hydrogenated amorphous silicon (a-Si:H)-film underneath the metal to passivate the doped c-Si surface and suppress the recombination of minority charge carriers. Simultaneously, this layer should provide a contact to the metal allowing majority charge carrier transport. A transparent conductive oxide is additionally inserted between the a-Si:H layer and the metal to ensure efficient carrier collection. This concept is inspired by the silicon heterojunction solar cells, a technology characterized by extremely high open-circuit voltages. The development of these new passivating contacts requires two features: a homojunction, for charge separation, and a silicon heterojunction contact for improved passivation. In this thesis, we explicitly focus on large-area thin-film deposition technology for fabrication of our devices, guaranteeing the scalability of our findings. The main results of this thesis are then threefold. First, we show that, using low-temperature plasma enhanced chemical vapor deposition, a doped homo-epitaxial layer can be deposited to form the homojunction. Second, we develop passivating contacts and optimize them in silicon heterojunction solar cells. An in-depth analysis of the contact formation is provided, including a detailed investigation of the relevant interfaces in our proposed structure. Finally, combining these two technologies, we demonstrate a proof-of-concept for these passivating contacts. Highly doped phosphorus- and boron-doped c-Si surfaces are shown to be efficiently passivated by a-Si:H layers and a lower contact resistivity is obtained for our optimized passivating contacts on such doped surfaces compared to a heterojunction contact on lightly doped surfaces. We show that homojunction solar cells on diffused and ion-implanted wafers featuring such passivating contacts (called homo-hetero cells hereinafter) yield improved open-circuit voltages compared to conventional homojunction solar cells, due to reduction of recombination losses. Additionally, the temperature coefficient of such homo-hetero solar cells is lower. With these advantages, the homo-hetero solar cells outperform homojunction solar cells when operating at a cell temperature above 60 °C. This work contributes to the research and development of high-efficiency silicon solar cells by providing new insights on the properties of contact formation and a novel contact-type.

EPFL2014

Passivating electron contact based on highly crystalline nanostructured silicon oxide layers for silicon solar cells

Christophe Ballif, Matthieu Despeisse, Franz-Josef Haug, Quentin Thomas Jeangros, Martin Ledinsky, Philipp Friedrich Hermann Löper, Xavier Niquille, Gizem Nogay, Josua Andreas Stückelberger, Philippe Wyss

We present a novel passivating contact structure based on a nanostructured silicon-based layer. Traditional poly-Si junctions feature excellent junction characteristics but their optical absorption induces current losses when applied to the solar cell front side. Targeting enhanced transparency, the poly-Si layer is replaced with a mixed-phase silicon oxide/silicon layer. This mixed-phase layer consists of an amorphous SiOx matrix with incorporated Si filaments connecting one side of the layer to the other, and is referred to as nanocrystalline silicon oxide (nc-SiOx) layer. We investigate passivation quality, measured as saturation current density, and nanostructural changes, characterized by Raman spectroscopy and transmission electron microscopy, carefully studying the influence of annealing dwell temperature. Excellent surface passivation on n-type and also p-type wafers is shown. An optimum annealing temperature of 950 °C is found, resulting in a saturation current density of 8.8 fA cm2 and 11.0 fA cm2 for n-type and p-type wafers, respectively. Even before forming gas annealing, emitter saturation current densities of 27.9 fA cm2 (n+/n junction) and 32.0 fA cm2 (n+/p junction) are reached. Efficient current extraction is presented with specific contact resistivities of 86 mΩ cm2 on n-type wafer and 19 mΩ cm2 on p-type wafers, respectively. High-resolution transmission electron microscopy reveals that the layer stack consists of intermixed SiOx and Si phases with the Si phases being partly crystalline already in the as-deposited state. Thermal annealing at temperatures > 850 °C further promotes crystallization of the Si-rich regions. The addition of the SiOx phase enhances the thermal stability of the contact and should allow to tune the refractive index and improve transparency, while still providing efficient electrical transport through the crystalline Si phase, which extends throughout almost the entire contact.

Elsevier Science Bv2016

Full-Area Passivating Contacts with High and Low Thermal Budgets: Solutions for High Efficiency c-Si Solar Cells

Gizem Nogay

Today more than 90% of the global PV market is covered by c-Si solar cells which are limited by recombination losses at the metal-semiconductor interface. This recombination path can be avoided by separating the metal from the c-Si wafer by introducing a buffer layer that passivates electronically the wafer surface while still allowing the flow of one type of carrier. Such structures are called carrier selective passivating contacts. In the scope of this thesis, carrier selective passivating contacts with low and high thermal budgets are investigated with the purpose of achieving a good understanding of the junction formation, the working principle, limiting factors, and integration requirements. Silicon heterojunction (SHJ) solar cells are studied as representatives for solar cells processed with low thermal budget. Solar cells with interfacial oxide contacts are investigated as the cell concept for high thermal budgets. To be industrially relevant, contact formation of the latter is studied with p-type wafers. The carrier selective passivating contacts based on microcrystalline silicon (mc-Si:H) are studied for SHJ solar cells with low thermal budget. It is demonstrated that mc-Si:H layers improve the optical and electrical performance of the SHJ solar cells compared to cells with purely amorphous contacts. However, as the layer crystallinity increases with thickness, a trade¿off between short circuit current density and fill factor is encountered. By combining a MoOx front hole-contact and a mc-Si:H(n) rear electron-contact, this trade¿off is avoided. Applying an electrodeposited copper front metallization, a short circuit current density of 38.9 mA/cm2 and a fill factor of to 80% are obtained leading to an efficiency of 22.5%. The passivating hole contacts with high thermal budget are developed using a chemically grown oxide (SiOx) and boron doped silicon-carbide which is deposited under Si-rich conditions by plasma enhanced chemical vapour deposition. It is observed that introducing an undoped Si inter¿layer between SiOx and SiCx(p) is necessary to prevent chemical reaction between carbon atoms in the SiCx(p) and the adjacent SiOx, and consequently to obtain wellpassivated SiOx/c-Si interface. With this contact structure, an implied open circuit voltage value of 718 mV and a specific contact resistivity value of 17m cm2 are attained. The contact structure is tested at device level by realizing proof-of-concept hybrid solar cells that feature a high thermal budget rear hole-contact and a low thermal budget SHJ front electron-contact. With this concept, the fill factor of 81.8% is attained. In an effort to improve the hole-contact property further, in-situ incorporation of fluorine into the boron-doped hole-contact is explored. It is observed that in the as-deposited state, fluorine is evenly distributed within the contact layer of SiCx:F(p). Upon annealing, fluorine diffuses toward the c-Si wafer and accumulates at the interface where it reduces the defect states. With this contact structure, implied open circuit voltage values up to 735mV are achieved. The potential of the fluorinated hole-contact is investigated at device level by realizing both sides-contacted co-processed solar. For this purpose in-situ phosphorous doped SiCx(n) layers were developed as a front contact. Planar, both sides-contacted p-type solar cells attain an impressive fill factor value of 84% and an open circuit voltage of 727 mV.

EPFL2018