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Thin Hydrogel-Elastomer Multilayer Encapsulation for Soft Electronics

Publications associées (32)

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System Design Automation: Challenges and Limitations

Joseph Sifakis

Electronic design automation (EDA) has enabled the integrated circuit industry to sustain exponentially increasing product complexity growth until today, while maintaining consistent product development timeline and costs. We argue that the success of EDA- ...

Ieee-Inst Electrical Electronics Engineers Inc2015

A Subcutaneous Biochip for Remote Monitoring of Human Metabolism: Packaging and Biocompatibility Assessment

Giovanni De Micheli, Sandro Carrara, Jacopo Olivo, Andrea Cavallini, Seyedeh Sara Ghoreishizadeh

This paper represents the extended version of the conference paper “Developing highly-integrated subcutaneous biochips for remote monitoring of human metabolism” pre- sented at the IEEE Sensors Conference 2012, and presents data on assembly, packaging and ...

Institute of Electrical and Electronics Engineers2015

Automated Design Flow for Multi-Functional Dataflow-Based Platforms

Marco Mattavelli, Simone Casale Brunet, Endri Bezati

The implementation of processing platforms supporting multiple applications by runtime reconfigurations on dedicated hardware modules requires the solution of different problems. These problems are notably not-trivial since both platform and application co ...

Springer Verlag2015

PCB Design and Fabrication for NEMS Applications

Christian Clerc

In this project, a resonator was theoretically defined and modelled in an effort to choose appropriate impedance matching between the resonator and outside electronics. Quite Universal Circuit Simulation (QUCS) was used to model the S-parameter of potentia ...

2015

Overview on low temperature co-fired ceramic sensors

Thomas Maeder

Low Temperature Co-fired Ceramics (LTCC) is one of the microelectronic techniques. This technology was initially developed as an alternative to Printed Circuit Boards (PCB) and classical thick-film technology, and it has found application in the fabricatio ...

Elsevier2015

Hybrid stretchable circuits on silicone substrate

Stéphanie Lacour

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hyb ...

American Institute of Physics2014

Design Methodologies and CAD for Emerging Nanotechnologies

Shashi Kanth Bobba

With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...

EPFL2013

Applications of dry photoresist film for printed and flexible electronics

Nico de Rooij, Danick Briand, Andres Felipe Vasquez Quintero

This work presents three applications of dry photoresist film for printed and flexible electronics devices. First, as part of the flexible encapsulation of printed gas sensors (i.e. humidity). This process was performed at relatively low temperatures (85 ° ...

2013

Closing the Gap between FPGA and ASIC

Hadi Parandeh Afshar

Despite many advantages of Field-Programmable Gate Arrays (FPGAs), they fail to take over the IC design market from Application-Specific Integrated Circuits (ASICs) for high-volume and even medium-volume applications, as FPGAs come with significant cost in ...

EPFL2012

Environmental monitoring with a multisensor platform on polyimide foil

Nico de Rooij, Danick Briand, Jérôme Courbat

A multisensor platform on plastic foil for environmental monitoring has been produced and its gas sensing performance, investigated. It is an array of conductometric metal-oxide (MOX) and capacitive polymer gas sensors integrated with a resistive platinum ...

Elsevier2012