Publication

Engineering reversible elasticity in ductile or brittle thin films and products resulting from said engineering

Résumé

The present invention relates to how to engineer reversible elasticity in thin films and/or layers and/or substrates, using a repeated Y-shaped motif, which is cut out throughout the film and/or layer and/or substrate. As an example, using a 75 μm thick polyimide (PI) foil, macroscopic dog-bone shaped structures with a range of geometrical parameters of the Y shape have been prepared according to an embodiment of the present invention. The tensile strain response of the film at its point of fracture was then recorded. The structures were also confirmed using Finite Element Modeling. Upon stretching, the PI ligaments locally deflect out of plane, allowing the foil to macroscopically stretch.

À propos de ce résultat
Cette page est générée automatiquement et peut contenir des informations qui ne sont pas correctes, complètes, à jour ou pertinentes par rapport à votre recherche. Il en va de même pour toutes les autres pages de ce site. Veillez à vérifier les informations auprès des sources officielles de l'EPFL.