Publication

The 2024 Magnonics Roadmap

Publications associées (53)

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Quantification and Modeling of Wet-Antenna Attenuation for Commercial Microwave Links

Alexis Berne, Marc Schleiss

Data from a new experimental setup deployed in Dübendorf (Switzerland) are used to quantify and model the magnitude and dynamics of the wet-antenna attenuation (WAA) affecting a 1.85-km commercial microwave link at 38 GHz. The results show that the WAA exh ...

2013

Editorial

Giovanni De Micheli, Subhasish Mitra, Maciej Jerzy Ogorzalek

In recent years, we have observed spectacular advancements in the area of nano-circuits and systems at several levels, from the fabrication material and device levels to the system and application levels. New emerging materials provide us with a wealth of ...

2012

Substrate Current Modeling for high Temperature Smart Power BCD Technology

Fabrizio Lo Conte

The electronics industry is present nowadays in the most various applications. A new type of technology for integrated circuits named BCD has started to be developed and appeared from the mid 1980’s. This new technology allows integrating bipolar transisto ...

EPFL2012

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Hu Xu

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated se ...

EPFL2012

Alginate beads and epoxy resin composites as candidates for microwave absorbers

Jutta Christine Wandrey

This paper presents a new composite material, which is developed by mixing calcium alginate spheres with commercially available epoxies Stycas 2850 FT (s2850) and Stycast W19 (W19). The resulting composite material is examined in terms of transmission and ...

2012

Design of Resonant Clock Distribution Networks for 3-D Integrated Circuits

Giovanni De Micheli, Vasileios Pavlidis, Somayyeh Rahimian Omam

Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low-power alternatives to conventional cl ...

Springer-Verlag2011

Reliability in the Dark Silicon Era

Babak Falsafi

Information technology is now an indispensable pillar of a modern-day society, thanks to the proliferation of digital platforms in the past several decades. The demand on robust and economical data processing and storage, however, is growing faster than te ...

IEEE Computer Soc Press, Customer Service Center, Po Box 3014, 10662 Los Vaqueros Circle, Los Alamitos, CA 907202011

Fill-ins number reducing direct solver designed for FIT-type matrix

Michal Karol Dobrzynski, Jagoda Anna Dobrzynska

This paper investigates the particular problem of matrices appearing during the modeling of Integrated Circuits with Finite Integration Technique (FIT) method. We present the key points of FIT approach followed by an illustration of the structure and the p ...

Elsevier2010

Generic DSP-based Implantable Body Sensor Node

Léandre Bolomey

To improve health, to help to manage chronical disease and to provide equal access to healthcare, continuous monitoring of physiological parameter associated to telemedicine is mandatory. In this perspective Body Sensor Networks concept has emerged. It inc ...

EPFL2010

Integrated circuit comprising an array of single photon avalanche diodes

Edoardo Charbon, Cristiano Niclass

Integrated circuit (1) comprising: an array of single photon avalanche diodes (SPADs), a plurality of read-out circuits, each SPADs being coupled to one read-out circuit, wherein at least some of the read-out circuits comprise time-to-digital converters (T ...

2009