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Fabrication and application of a full wafer size micro/nanostencil for multiple length-scale surface patterning

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Fabrication and application of a full wafer size micro/nanostencil for multiple length-scale surface patterning

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90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

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DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.

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Powder blasting for three-dimensional microstructuring of glass

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Etching of platinum thin films with dual frequency ECR/RF reactor

High aspect ratio UV photolithography for electroplated structures

Etching of RuO2 and Pt thin films with ECR/RF reactor

Etching of platinum thin films with dual frequency ECR/RF reactor

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.

High aspect ratio UV photolithography for electroplated structures

Powder blasting as a three-dimensional microstructuring technology for MEMS applications

Low numerical aperture refractive microlenses in fused silica

Powder blasting for three-dimensional microstructuring of glass

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

Mechanisms of Pb(Zr0.53Ti0.47)O-3 thin film etching with ECR/RF reactor