HIGH ASPECT RATIO SiLICON NANOFABRICATION (HARSiN) TECHNOLOGY
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Fused silica microlenses with low numerical apertures (NAs) were fabricated. The original photoresist element was realized by the melting resist technology and was transferred into fused silica by reactive ion etching. Low selectivity etching was applied t ...
We present an optical investigation of GaN pillars using both micro-Raman (mu-Raman) and microphotoluminescence (mu-PL) spectroscopy. GaN pillars of diameter ranging from 100 nm to 5 mum were fabricated by electron beam lithography and reactive ion etching ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical parameters during etching of RuO2 and Pr by a dual frequency ECR/RF reactor have been investigated. The ...
Research and development in the field of electroceramics is driven by technology and device applications. It includes research on a broad spectrum of inorganic materials, and it covers all scales from the level of the crystalline lattice to that of final d ...
Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single- ...
We report on powder blasting as a promising technology for the three-dimensional structuring of brittle materials. We investigate the basic parameters of this process, which is based on the erosion of a masked substrate by a high-velocity eroding powder be ...
Characterization of the mechanical and thermal properties of the high aspect- ratio, negative, UV resist, SU-S has been carried out. This resist allows for a broad range of thicknesses to be obtained with a single spin process. Standard exposure with a UV ...
