Mechanical characterization of a new high-aspect-ratio near UV-photoresist

Characterization of the mechanical and thermal properties of the high aspect- ratio, negative, UV resist, SU-S has been carried out. This resist allows for a broad range of thicknesses to be obtained with a single spin process. Standard exposure with a UV aligner has produced outstanding aspect ratios, 15 for lines and trenches. This type of performance lends itself well to MEIMS applications, packaging, micromolds, spacers, etc. Because of the simplicity of use of the resist in addition to the large range of possible applications, the process dependent mechanical and thermal properties must be understood in order to completely exploit the potential of the resist.