Protecting FinFilm in Flexible Probes

This lecture focuses on the importance of protecting the FinFilm material in flexible probes to ensure the functionality of electronic devices. The instructor explains the significance of considering the nature of the substrate, the strain limits of different materials, and the impact of stress on the overall structure. The discussion covers the process of microfabrication on flexible substrates, highlighting challenges such as stress-induced deformation and misalignment during lithography. Strategies to minimize strain, optimize material selection, and enhance device stability are explored, emphasizing the critical role of mechanical design in integrating fragile materials into bendable structures.