Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCB), so named because it conforms to the contours of the PCB. Conformal coatings are typically applied at 25–250 μm to the electronic circuitry and provide protection against moisture, dust, chemicals, and temperature extremities. More recently, conformal coatings are being used to reduce the formation of whiskers, and can also prevent current bleed between closely positioned components.
Coatings can be applied in a number of ways including brushing, spraying, dispensing, and dip coating. A number of materials can be used as a conformal coating such as acrylics, silicones, urethanes and parylene. Each has its own characteristics, making them preferred for certain environments and manufacturing scenarios. Many circuit board assembly firms can coat assemblies with a layer of transparent conformal coating, which is lighter and easier to inspect than potting.
Conformal coatings are used to protect electronic components from the environmental factors they are exposed to. Examples of these factors include moisture, dust, salt, chemicals, temperature changes and mechanical abrasion. Successful conformal coating will prevent the board from corroding. More recently, conformal coatings are being used to reduce the formation of whiskers, and can also prevent current bleed between closely positioned components.
Conformal coatings are breathable, allowing trapped moisture in electronic boards to escape while maintaining protection from contamination. These coatings are not sealants, and prolonged exposure to vapours will cause transmission and degradation to occur. There are typically four classes of conformal coatings: Acrylic, Urethane, Silicone, and Varnish.
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Soldering (USˈsɒdərɪŋ; UKˈsoʊldərɪŋ) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint. Soldering is commonly used in the electronics industry for the manufacture and repair of printed circuit boards (PCBs) and other electronic components. It is also used in plumbing and metalwork, as well as in the manufacture of jewelry and other decorative items.
Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Explores the behavior, properties, and applications of polyelectrolyte hydrogels, including swelling, deformation, stress-strain behavior, and mechanical properties, as well as self-healing and assembly processes.
Ni-P electroless coatings are widely applied for protection of magnesium alloys and other materials due to the low energy consumption of the process and high resistance to corrosion and wear, properties that can be improved with the incorporation of partic ...
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When a liquid film lies on a nonwettable substrate, the configuration is unstable, and the film spontaneously ruptures to form droplets. This phenomenon, known as dewetting, commonly leads to undesirable morphological changes. Nevertheless, recent works, c ...
2021
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We report the first demonstration of fully-vertical power MOSFETs on 6.6-μm-thick GaN grown on a 6-inch Si substrate by metal-organic chemical vapor deposition (MOCVD). A robust fabrication method was developed based on a selective and local removal of the ...