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Concept
Solder
Summary
Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing.
In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point. Non-eutectic alloys can have markedly different solidus and liquidus temperatures, as they have distinct liquid and solid transitions. Non-eutectic mixtures often exist as a paste of solid particles in a melted matrix of the lower-melting phase as they approach high enough temperatures. In electrical work, if the joint is disturbed while in this "pasty" state before it fully solidifies, a poor electrical connection may result; use of eutectic solder reduces this problem. The pasty state of a non-eutectic solder can be exploited in plumbing, as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so-called "wiped joint".
For electrical and electronics work, solder wire is available in a range of thicknesses for hand-soldering (manual soldering is performed using a soldering iron or soldering gun), and with cores containing flux.
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Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure
John Botsis, Joël Cugnoni, Milad Maleki
In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu jo
Elsevier2016Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response
John Botsis, Joël Cugnoni, Milad Maleki
Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstruc
Springer2014Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder
John Botsis, Joël Cugnoni, Milad Maleki
The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of t
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Tin
Tin is a chemical element with the symbol Sn () and atomic number 50. A silvery-coloured metal, tin is soft enough to be cut with little force, and a bar of tin can be bent by hand with little effort. When bent, the so-called "tin cry" can be heard as a result of twinning in tin crystals; this trait is shared by indium, cadmium, zinc, and mercury in its solid state. Pure tin after solidifying presents a mirror-like appearance similar to most metals. In most tin alloys (e.g. pewter) the metal solidifies with a dull grey colour.
Solder
Solder (UKˈsɒldə,_ˈsəʊldə; NA: ˈsɒdər) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Zinc
Zinc is a chemical element with the symbol Zn and atomic number 30. Zinc is a slightly brittle metal at room temperature and has a shiny-greyish appearance when oxidation is removed. It is the first element in group 12 (IIB) of the periodic table. In some respects, zinc is chemically similar to magnesium: both elements exhibit only one normal oxidation state (+2), and the Zn2+ and Mg2+ ions are of similar size. Zinc is the 24th most abundant element in Earth's crust and has five stable isotopes.
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Covers soldering and brazing fundamentals, eutectic alloys, joint interfaces, fluxes, aluminum brazing challenges, and hybrid metal-ceramic parts.