Summary
Microcontact printing (or μCP) is a form of soft lithography that uses the relief patterns on a master polydimethylsiloxane (PDMS) stamp or Urethane rubber micro stamp to form patterns of self-assembled monolayers (SAMs) of ink on the surface of a substrate through conformal contact as in the case of nanotransfer printing (nTP). Its applications are wide-ranging including microelectronics, surface chemistry and cell biology. Both lithography and stamp printing have been around for centuries. However, the combination of the two gave rise to the method of microcontact printing. The method was first introduced by George M. Whitesides and Amit Kumar at Harvard University. Since its inception many methods of soft lithography have been explored. Creation of the master, or template, is done using traditional photolithography techniques. The master is typically created on silicon, but can be done on any solid patterned surface. Photoresist is applied to the surface and patterned by a photomask and UV light. The master is then baked, developed and cleaned before use. In typical processes the photoresist is usually kept on the wafer to be used as a topographic template for the stamp. However, the unprotected silicon regions can be etched, and the photoresist stripped, which would leave behind a patterned wafer for creating the stamp. This method is more complex but creates a more stable template. After fabrication the master is placed in a walled container, typically a petri dish, and the stamp is poured over the master. The PDMS stamp, in most applications, is a 10:1 ratio of silicone elastomer and a silicone elastomer curing agent. This mixture consists of a short hydrosilane crosslinker that contains a catalyst made from a platinum complex. After pouring, the PDMS is cured at elevated temperatures to create a solid polymer with elastomeric properties. The stamp is then peeled off and cut to the proper size. The stamp replicates the opposite of the master. Elevated regions of the stamp correspond to indented regions of the master.
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Related concepts (1)
Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate.