Are you an EPFL student looking for a semester project?
Work with us on data science and visualisation projects, and deploy your project as an app on top of Graph Search.
Concept
Quad flat package
Summary
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).
The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB).
A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components.
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively). However, this close lead spacing made solder bridges more likely and put higher demands on the soldering process and alignment of parts during assembly. The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing.
Cyrix cx9210 gfdl (cropped).jpg|144-pin low profile quad flat package (LQFP)
PIC18F8720.jpg|80-pin thin quad flat package (TQFP) – [[PIC microcontroller]]
Sega 304-pin QFP.jpg|304-pin plastic quad flat package (QFP) with exposed [[thermally conductive pad|thermal pad]] (TP)
Cyrix Cx486SLCe-V25MP DF7339E top.jpg|100-pin bumpered quad flat package (BQFP) – [[Cyrix Cx486SLC]]
CRQFP80 UV ST62E40.
Official source
About this result
This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.