Publications associées à Quad Flat Package

REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Darong Huang, Rafael Medina Morillas

2.5D Systems-on-Package (SoPs) are composed by several chiplets placed on an interposer. They are becoming increasingly popular as they enable easy integration of electronic components in the same package and high fabrication yields. Nevertheless, they int ...

2023

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Duccio Testa, Marcus Cemes, Ambrine Douhane

Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...

2023

Integration of hybrid material systems in conformable neural interfaces

Florian Dylan Fallegger

Neural interfaces are devices that are implanted into the body and interface electrically with the central (CNS) or peripheral nervous system. They are inserted surgically for short periods of time or chronically to diagnose or treat several neural disease ...

EPFL2020

Characterization and Analysis of On-Chip Microwave Passive Components at Cryogenic Temperatures

Edoardo Charbon, Andrea Ruffino, Fabio Sebastiano

This paper presents the characterization and modeling of microwave passive components in TSMC 40-nm bulk CMOS, including metal-oxide-metal (MoM) capacitors, transformers, and resonators, at deep cryogenic temperatures (4.2 K). To extract the parameters of ...

2020

Chip-scale Optical Resonator Enabled Synthesizer (CORES) Miniature systems for optical frequency synthesis

Tobias Kippenberg, Nicolas Volet, Hairun Guo, Martin Hubert Peter Pfeiffer

An approach for a low-power chip-scale package is described, that provides a laser output with a programmable frequency across 50 nm of bandwidth centered at 1550 nm, and a resolution of one part in 10(14). ...

Ieee2016

Comparison of Two Approaches for Nuclear Data Uncertainty Propagation in MCNPX for Selected Fast Spectrum Critical Benchmarks

Andreas Pautz, Hakim Ferroukhi, Dimitri Rochman, Tiankai Zhu, Alexander Vasiliev

Nuclear data uncertainty propagation based on stochastic sampling ( SS) is becoming more attractive while leveraging modern computer power. Two variants of the SS approach are compared in this paper. The Total Monte Carlo (TMC) method by the Nuclear Resear ...

Academic Press Inc Elsevier Science2014

Miniature curved artificial compound eyes

Dario Floreano, Ramon Pericet Camara, Géraud L'Eplattenier, Michal Karol Dobrzynski

In most animal species, vision is mediated by compound eyes, which offer lower resolution than vertebrate single-lens eyes, but significantly larger fields of view with negligible distortion and spherical aberration, and high temporal resolution in a tiny ...

National Academy of Sciences2013

Thermal Simulation of Liquid-Cooled Integrated Circuits

Arvind Raj Mahankali Sridhar

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

Remotely Powered Wireless Cortical Implants for Brain-Machine Interfaces

Kanber Mithat Silay

Brain-machine interfaces hold promise for restoring basic functions such as movement or speech for severely disabled patients, as well as for controlling neuroprosthetic devices for amputees. One of the major challenges of clinically viable neuroprostheses ...

EPFL2012

3D structuration of LTCC and related technologies for thermal management and microfluidic structures

Peter Ryser, Thomas Maeder, Caroline Jacq, Bo Jiang, Fabrizio Vecchio, Conor Joseph Slater

Ceramic technologies such as LTCC (Low Temperature Co-fired Ceramic) and thick-film are used widely in electronic circuits exposed to harsh environments, for applications in fields such as aerospace, automotive and energy exploration, where, owing to their ...

Soc Microelectronics, Electron Components Materials-Midem2012