Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...
This paper describes recent progress in the development of Nb3Sn wires in Switzerland using the internal tin method The work war carried out in close collaboration between the Fusion Technology Division of CRPP and Swissmetal, with the emphasis on conducto ...
This paper represents the extended version of the conference paper “Developing highly-integrated subcutaneous biochips for remote monitoring of human metabolism” pre- sented at the IEEE Sensors Conference 2012, and presents data on assembly, packaging and ...
Institute of Electrical and Electronics Engineers2015
In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...
Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008
To investigate synaptic events underlying sensory perception, we made whole-cell membrane potential recordings of barrel cortex neurons in awake mice while recording whisker-related behavior. During quiet periods, we recorded slow, large-amplitude membrane ...
This is the first account of the history of our understanding of, and ability to model, solidification microstructures. Its objective is to retrace the scientific steps made, from the earliest observations of the eighteenth century to our present-day under ...
This is the first account of the history of modelling dendritic and cellular solidification. While Part I reviewed the progress up to the year 2000 [Kurz W, Fisher DJ, Trivedi R. Progress in modelling solidification microstructures in metals and alloys: de ...
Whiskers (also known as vibrissae) are sensory organs that are thought to have first appeared in Therapsida, a group of synapsids that includes mammals and evolutionary ancestors like the Thrinaxodon(1). They are highly conserved among mammals to the notab ...
Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...
A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...