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3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

An Integrated Control and Readout Circuit for Implantable Multi-Target Electrochemical Biosensing

Minimum energy path and atomistic mechanism of the elementary step in oxygen diffusion in silicon: A density-functional study

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Integrated Source of Spectrally Filtered Correlated Photons for Large-Scale Quantum Photonic Systems

Unison Cache: A Scalable and Effective Die-Stacked DRAM Cache

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Unison Cache: A Scalable and Effective Die-Stacked DRAM Cache

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

Minimum energy path and atomistic mechanism of the elementary step in oxygen diffusion in silicon: A density-functional study

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

An Integrated Control and Readout Circuit for Implantable Multi-Target Electrochemical Biosensing

Low Power 3D Serial TSV Link for High Bandwidth Cross-Chip Communication

Integrated Source of Spectrally Filtered Correlated Photons for Large-Scale Quantum Photonic Systems