Concept
Intel
Related concepts (37)
Broadcom
Broadcom Inc. is an American multinational designer, developer, manufacturer, and global supplier of a wide range of semiconductor and infrastructure software products. Broadcom's product offerings serve the data center, networking, software, broadband, wireless, storage, and industrial markets. As of 2022, some 78 percent of Broadcom's revenue was coming from its semiconductor-based products and 22 percent from its infrastructure software products and services. Tan Hock Eng is the company's president and CEO.
Self-aligned gate
In semiconductor electronics fabrication technology, a self-aligned gate is a transistor manufacturing approach whereby the gate electrode of a MOSFET (metal–oxide–semiconductor field-effect transistor) is used as a mask for the doping of the source and drain regions. This technique ensures that the gate is naturally and precisely aligned to the edges of the source and drain. The use of self-aligned gates in MOS transistors is one of the key innovations that led to the large increase in computing power in the 1970s.
Westmere (microarchitecture)
Westmere (formerly Nehalem-C) is the code name given to the 32 nm die shrink of Nehalem. While sharing the same CPU sockets, Westmere included Intel HD Graphics, while Nehalem did not. The first Westmere-based processors were launched on January 7, 2010, by Intel Corporation. The Westmere architecture has been available under the Intel brands of Core i3, Core i5, Core i7, Pentium, Celeron and Xeon. Westmere's feature improvements from Nehalem, as reported: Native six-core (Gulftown) and ten-core (Westmere-EX) processors.
Tick–tock model
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel. Under this model, every microarchitecture change (tock) was followed by a die shrink of the process technology (tick). It was replaced by the process–architecture–optimization model, which was announced in 2016 and is like a tick–tock cycle followed by an optimization phase. As a general engineering model, tick–tock is a model that refreshes one side of a binary system each release cycle.
HP Inc.
HP Inc. (formerly an acronym for Hewlett-Packard) is an American multinational information technology company headquartered in Palo Alto, California, that develops personal computers (PCs), printers and related supplies, as well as 3D printing solutions. It was formed on November 1, 2015, as the legal successor of the original Hewlett-Packard Company after the company's enterprise product and business services divisions were spun off as a new publicly traded company, Hewlett Packard Enterprise. HP Inc.
Thermal design power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
SpeedStep
Enhanced SpeedStep is a series of dynamic frequency scaling technologies (codenamed Geyserville and including SpeedStep, SpeedStep II, and SpeedStep III) built into some Intel microprocessors that allow the clock speed of the processor to be dynamically changed (to different P-states) by software. This allows the processor to meet the instantaneous performance needs of the operation being performed, while minimizing power draw and heat generation. EIST (SpeedStep III) was introduced in several Prescott 6 series in the first quarter of 2005, namely the Pentium 4 660.