Concept

Wafer-level packaging

Related publications (55)

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Scalable Approaches to III-V Nanowires for Photodetection

Nicholas Paul Morgan

III-V semiconductor nanowires have unique properties that make them ideal for advanced photodetectors on inexpensive substrates. For example, they exhibit enhanced or polarization-dependent light absorption, they can form complex heterostructures, and thei ...

EPFL2023

Scalable fabrication of functional nanostructures on stretchable substrates by capillary-assisted particle assembly and adhesion lithography

Henry Shao-Chi Yu

The fabrication of metallic nanostructures on stretchable substrates enables specific applications that exploit the combination of the nano-scale phenomena and the mechanical tunability of the physical dimensions of the nanostructures. Due to the large dif ...

EPFL2022

Controlled filamentation instability as a scalable fabrication approach to flexible metamaterials

Fabien Sorin, Pierre-Luc Eloi Piveteau, William Nicolas Duncan Esposito, Louis Marie Philippe Martin-Monier

Long and flexible arrays of nanowires find impactful applications in sensing, photonics, and energy harvesting. Conventional manufacturing relies largely on lithographic methods limited in wafer size, rigidity, and machine write time. Here, we report a sca ...

NATURE PORTFOLIO2022

Low-noise frequency-agile photonic integrated lasers for coherent ranging

Tobias Kippenberg, Rui Ning Wang, Anat Siddharth, Andrey Voloshin, Viacheslav Snigirev, Junqiu Liu, Wenle Weng, Jijun He, Vladimir Shadymov

Stable and tunable integrated lasers are fundamental building blocks for applications from spectroscopy to imaging and communication. Here the authors present a narrow linewidth hybrid photonic integrated laser with low frequency noise and fast linear wave ...

NATURE PORTFOLIO2022

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers

Edoardo Charbon, Sandro Carrara, Simone Frasca

A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having ...

2021

Wafer-Scale Fabrication of Nanopore Devices for Single-Molecule DNA Biosensing using MoS2

Aleksandra Radenovic, Andras Kis, Martina Lihter, Mukesh Kumar Tripathi, Mukeshchand Thakur, Andrey Chernev, Michael Graf, Michal Daniel Macha, Jochem Deen

Atomically thin (2D) nanoporous membranes are an excellent platform for a broad scope of academic research. Their thickness and intrinsic ion selectivity (demonstrated for example in molybdenum disulfide-MoS2) make them particularly attractive for single-m ...

2020

Toward ultra-low power design methodology for frequency generation in the IoT design space

Mathieu Yves Hervé Coustans

Today, the semiconductor industry is feeding our digital world with more and more data coming from compact embedded electronics that are monitoring our environment and feeding analytics for action. Interaction with our digital world is mostly achieved thro ...

EPFL2019

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Mikhail Asiatici, Göran Stemme

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

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