Concept

Wafer-level packaging

Related publications (55)

Lab-on-a-chip implants: a mini lab under the skin

We have realized an implantable and wearable system for the continuous monitoring of human metabolites, such as glucose, lactate, ATP, etc.. The implantable portion of the device consists of a cylinder of 2.2 mm in diameter and 15 mm in length to be insert ...

2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Large-scale, in-situ integration of horizontal carbon nanotube arrays into gas sensing devices

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Hoël Maxime Guérin

The successful experimental demonstration of large-scale and in-situ growth of horizontal, dense and aligned carbon nanotube (CNT) arrays is presented. This new CNT growth process is developed for the direct integration of nanotubes into gas sensing device ...

2013

Electrical contacts to single nanowires: a scalable method allowing multiple devices on a chip. Application to a single nanowire radial p-i-n junction

Martin Heiss, Anna Dalmau Mallorquí, Carlo Colombo, Pierre Loïc Blanc

Semiconductor nanowires are currently at the forefront of research in the areas of nanoelectronics and energy conversion. In all these studies, realising electrical contacts and statistically relevant measurements is a key issue. We propose a method that e ...

Inderscience2013

Wafer-level integrated electrospray emitters for a pumpless microthruster system operating in high efficiency ion-mode

Herbert Shea, Caglar Ataman, Simon Dandavino

Microfabrication, wafer-level integration, and characterization of internally fed arrays of electrospray thrusters for spacecraft propulsion are discussed. 5 μm inner diameter, 100 μm long capillaries and 150-to-300 μm diameter annular extractor electrodes ...

Ieee2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

In-situ grown horizontal carbon nanotube membrane

Mihai Adrian Ionescu, Dimitrios Tsamados, Hoël Maxime Guérin

We present the successful fabrication of horizontally grown and dense carbon nanotube (CNT) membranes in situ. A TiN/Al2O3/TiN stack is first patterned to be employed as a support for the CNT growth. Iron is then evaporated with a 45 degrees tilt angle on ...

Elsevier2012

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Michail Zervas, Yusuf Leblebici, Alessandro Cevrero, Yüksel Temiz, Giulia Beanato, Panagiotis Athanasopoulos, Paolo Giovannini

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...

2012

Self-Assembled Electrical Biodetector Based on Reduced Graphene Oxide

Klaus Kern, Subramanian Sundaram, Kannan Balasubramanian, Ravi Shankar Sundaram

Large-scale fabrication of graphene-based devices is an aspect of great importance for various applications including chemical and biological sensing. Toward this goal, we present here a novel chemical route for the site-specific realization of devices bas ...

2012

Dynamically programmable parylene-C bonding layer fluorescence for re-writable data storage on a microfluidic chip

Martinus Gijs, Ata Tuna Ciftlik

Wafer bonding using parylene-C to Si, SiO2 and SiN surfaces has recently been shown to enable high pressure-resistant microfluidic devices with metallization and CMOS-integration capability. Here, we report characterization of intermediate parylene-C bondi ...

2012

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