Photolithography

In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Typically, ultraviolet light is used to transfer a geometric design from an optical mask to a light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents, also known in this case as developers. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultraviolet, extreme ultraviolet, or X-ray. The wavelength of light used determines the minimum feature size that can be formed in the photoresist. Photolithography is a subclass of microlithography, the general term for processes that generate patterned thin films. Other technologies in this broader class include the use of steerable electron beams, or more rarely, nanoimprinting, interference, magnetic fields, or scanning probes. On a broader level, it may compete with directed self-assembly of micro- and nanostructures. Photolithography shares some fundamental principles with photography in that the pattern in the photoresist is created by exposing it to light — either directly by projection through a lens, or by illuminating a mask placed directly over the substrate, as in contact printing. The technique can also be seen as a high precision version of the method used to make printed circuit boards. The name originated from a loose analogy with the traditional photographic method of producing plates for lithographic printing on paper; however, subsequent stages in the process have more in common with etching than with traditional lithography.

Subwavelength imaging using a solid-immersion diffractive optical processor

Growth and Doping Mechanisms of III-V Nanostructures by Selective Area Epitaxy

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Growth and Doping Mechanisms of III-V Nanostructures by Selective Area Epitaxy

First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques

Subwavelength imaging using a solid-immersion diffractive optical processor