Concept

Solder paste

Related publications (28)

Towards reliable 100-nanometer scale stencil lithography on full wafer: Progress and challenges

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart, Oscar Vazquez Mena

We have fabricated new and robust nanostencil membranes for the surface patterning of 100-nm scale At wires on full wafer scale. The stencil membranes are mechanically reinforced with corrugations, making them more stable against accumulated stress. The ap ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2007

Fabrication of low temperature co-fired ceramic (LTCC)-based sensor and micro-fluidic structures

Hansu Birol

Low temperature co-fired ceramic (LTCC) technology has attracted remarkable attention in fabrication of sensors and micro-fluidic devices in the last decade. Although structuring planar LTCC foils, which are processed and screen-printed with thick-films, s ...

EPFL2007

Superparamagnetic iron oxide nanoparticle coupled tissue soldering

Heinrich Hofmann, Alke Fink, Benedikt Steitz

The invention relates to superparamagnetic iron oxide nanoparticles for use in sutureless thermal mediated tissue fusion. The nanoparticles are dispersed in a biocompatible solder material and heated by application of an alternating electromagnetic field. ...

2007

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006

Influence of lamination parameters on LTCC shrinkage under unconstrained sintering

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Louis-Séverin Bieri

LTCC (Low-Temperature Cofired Ceramic) has attracted considerable interest as a material for sensors and microfluidic circuits, for which dimensional accuracy is essential. The irregular shrinkage behaviour of LTCC tapes must be taken into account when des ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...

2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Contact resistance distribution at the termination of cable-in-conduit conductors

Pierluigi Bruzzone

For large cable-in-conduit conductors, a current unbalance among the strands may be the reason for reduced performance in both de and pulsed operation, The resistance distribution of the strands at the conductor termination has been investigated as the kev ...

2001

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