Concept

System in a package

Related publications (110)

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

Real-Time High-Sensitivity Impedance Measurement Interface for Tethered BLM Biosensor Arrays

Giovanni De Micheli, Horst Vogel, Carlotta Guiducci, Samuel Terrettaz, Yusuf Leblebici, Luca Benini, Yüksel Temiz

This paper presents a switched-capacitor (SC) current integrator circuit for impedance measurement of tethered bilayer lipid membrane (tBLM) biosensors. The circuit comprises a small number of high performance components enabling enhanced experimental flex ...

2008

Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays

Giovanni De Micheli, Horst Vogel, Carlotta Guiducci, Samuel Terrettaz, Yusuf Leblebici, Luca Benini, Yüksel Temiz

2008

On-Chip Sandwich Immunoassay in an Integrated Magneto-Optical CMOS Microsystem

Edoardo Charbon, Martinus Gijs, Ulrike Lehmann, Emile Dupont

We report on an innovative approach to on-chip detection of single fluorescently-labeled magnetic micro-particles by means of Single Photon Avalanche Diode (SPAD) arrays. Our system enables particle separation through magnetic actuation and highly sensitiv ...

2008

Reliability analysis of lead-free solders for an aerospace application

A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...

2008

Reliability analysis of lead-free solders for an aerospace application

2008

Method to design network-on-chip (noc)-based communication systems

Giovanni De Micheli, Luca Benini, Srinivasan Murali

To tackle the increasing communication complexity of multi-core systems, scalable Networks on Chips (NoCs) are needed to interconnect the processor, memory and hardware cores of the systems. For the use of NoCs to be feasible in today's industrial designs, ...

2008

Microsystem technologies for implantable applications

Nico de Rooij

Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...

2007

Integration of MOX gas sensors on polyimide hotplates

Nico de Rooij, Danick Briand, Jérôme Courbat

In this communication, we report on the integration of metal-oxide gas sensors on polymeric micro-hotplates made on polyimide and silicon substrates. Low-power consumption micro-hotplates with platinum electrodes and heaters were fabricated on polyimide me ...

2007

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