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A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...
A 3D explicit FEM package has been developed to analyze the deformation and failure process of materials under impact loading. The package is constituted of a finite deformation plastic model, a frictional contact algorithm, an adaptive meshing capability, ...
High temperatures, very high pressures and/or the presence of aggressive media cannot be covered by standard packaging methods, which only provide limited environmental stability. Ceramic technologies such as LTCC (Low Temperature Cofired Ceramic) and thic ...
This work was carried out in a collaborative framework between Ecole Polytechnique Fédérale de Lausanne and an industrial partner ST Microelectronics. RF MEMS passives are key devices for the RF front-end in modern transceiver and receiver architectures, o ...
This paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating the use of glue and O-rin ...
The Quantum-ESPRESSO package is a multipurpose and multi-platform software for ab-initio calculations of condensed matter (periodic and disordered) systems. Codes in the package are based on density functional theory and on a plane wave/pseudopotential des ...
Low Temperature Co-fired Ceramic (LTCC) Technology is recentlyaddressed to be a key approach among advanced packaging technologies, offering many advantages over its competitors. One of its most attractivefeatures is the ease of 3-D structuration thanks to ...
AIN is a material used in a wide variety of applications such as electroacoustic devices, blue diodes, IR windows, thermal conductors, metal-insulator-semiconductor structures, integrated circuit packaging, etc. In this work thin piezoelectric AIN polycrys ...
In the first part of the paper, also in this issue of the JOURNAL, the design of the frequency synthesizer and receiver section of an FSK transceiver was described. It operates in the 434-MHz ISM (Industrial, Scientific, Medical) band and is realized in a ...
The purpose of this paper is to provide an overview of our approach for modeling enterprise web applications (EWA), which is use case driven and uses UML as the modeling language. Our approach delivers a conceptual, logical model of the application, which ...