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Related publications (48)

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Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012

Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...

EPFL2012

Physical Design Issues in 3-D Integrated Technologies

Vasileios Pavlidis

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...

Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Reliability of rf mems capacitive switches and distributed mems phase shifters using aln dielectric

Mihai Adrian Ionescu, Montserrat Fernandez-Bolanos Badia, Dimitrios Tsamados

The reliability and charging/discharging dynamics of wideband (1.5-14GHz) phase shifters made of MEMS capacitive switches using Aluminum Nitride (AlN) as dielectric are originally reported. Phase shifter lifetimes exceeding 109 cycles are achieved in hot-c ...

2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

Self-Assembly from Milli- to Nanoscales: Methods and Applications

Massimo Mastrangeli

The design and fabrication techniques for microelectromechanical systems (MEMS) and nanodevices are progressing rapidly. However, due to material and process flow incompatibilities in the fabrication of sensors, actuators and electronic circuitry, a final ...

Institute of Physics2009

SU-8 microfluidic device for scintillating particle detection

Philippe Renaud, Alessandro Mapelli, Sébastien Jiguet, Noelia Vico Triviño

This paper presents the study of a novel scintillation detector based on standard microfabrication techniques. It consists of a fine pitch array of hollow waveguides filled with a liquid scintillator and optically coupled to photodetectors. The detector ha ...

Elsevier2009

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LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008