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Related publications (48)

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2008

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For the problem of boxed printed circuits embedded within a stratified media, efficient formulations. based on the Method of Moments have been suggested which involve the computation of modal series appearing in the representation of Greens,functions in th ...

Czechslovakia Section Ieee, Technicka 2, Praha 6, 166 27, Czech Republic2008

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This paper presents a switched-capacitor (SC) current integrator circuit for impedance measurement of tethered bilayer lipid membrane (tBLM) biosensors. The circuit comprises a small number of high performance components enabling enhanced experimental flex ...

2008

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2008

Reliability analysis of lead-free solders for an aerospace application

A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...

2008

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A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...

2007

A standard CMOS multi-channel single-chip receiver for multi-gigabit optical data communications

Paul Victor Georges Muller

As dictated by ongoing technology scaling and the advent of multi-core systems, each new generation of microprocessors and digital signal processors provides higher computing power and data throughput. However, the available bandwidth of the input/output ( ...

EPFL2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...

2006

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