Publications related to Induction sealing

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

Jürgen Brugger, Arnaud Bertsch, Cristina Martin Olmos, Jongeon Park

Precise packaging of nanoliter amounts of liquid in a microsystem is important for many biomedical applications. However, existing liquid encapsulation technologies have limitations in terms of liquid waste, evaporation, trapped bubbles, and liquid degrada ...

2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Paul Muralt, Thomas Maeder, Bo Jiang

Micro solid oxide fuel cells (μ-SOFCs) based on MEMS fabrication processes have become an increasingly attractive option for portable power generation applications, due to their high power density and their compatibility with hydrocarbon fuels. For system ...

IMAPS / ACerS2012

Nonparametric Construction of Multivariate Kernels

Victor Panaretos, Kjell Konis

We propose a nonparametric method for constructing multivariate kernels tuned to the configuration of the sample, for density estimation in R-d, d moderate. The motivation behind the approach is to break down the construction of the kernel into two parts: ...

American Statistical Association2012

Foil level packaging of a chemical gas sensor

Nico de Rooij, Danick Briand, Jérôme Courbat

A generic method for the packaging of transducers at the foil level is proposed and was demonstrated on chemical gas sensors made on a plastic foil. The processing was based on the lamination of pre-patterned polymeric structures on the fabricated devices ...

Institute of Physics2010

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

2008

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Induction sealing

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Nonparametric Construction of Multivariate Kernels

Foil level packaging of a chemical gas sensor

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Hermetic package for optical MEMS

Hermetic package for optical MEMS

Graph Chatbot

Chat with Graph Search

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Foil level packaging of a chemical gas sensor

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Hermetic package for optical MEMS

Hermetic package for optical MEMS

Nonparametric Construction of Multivariate Kernels