Concept
Celeron
Related concepts (37)
65 nm process
The 65 nm process is an advanced lithographic node used in volume CMOS (MOSFET) semiconductor fabrication. Printed linewidths (i.e. transistor gate lengths) can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm. For comparison, cellular ribosomes are about 20 nm end-to-end. A crystal of bulk silicon has a lattice constant of 0.543 nm, so such transistors are on the order of 100 atoms across. By September 2007, Intel, AMD, IBM, UMC and Chartered were also producing 65 nm chips.
Socket 479
Socket 479 (mPGA479M) is the CPU socket for the Intel Pentium M and Celeron M mobile processors normally used in laptops, but has also been used with Tualatin-M Pentium III processors. The official naming by Intel is μFCPGA and μPGA479M. There exist multiple electrically incompatible, but mechanically compatible processor families that are available in PGA packages using this socket or variants thereof: Socket 478 for Pentium 4 and Celeron series desktop CPUs; Socket 479 for Pentium III-M (released in 2001); Socket 479 for Pentium M and Celeron M 3xx (this was the most common version of the socket, and was released in 2003); Socket M for Intel Core, Core 2 and Celeron M 4xx and 5xx processors; and Socket P for Core 2 processors.
AMD K6-2
The K6-2 is an x86 microprocessor introduced by AMD on May 28, 1998, and available in speeds ranging from 266 to 550 MHz. An enhancement of the original K6, the K6-2 introduced AMD's 3DNow! SIMD instruction set, featured a larger 64 KiB Level 1 cache (32 KiB instruction and 32 KiB data), and an upgraded system-bus interface called Super Socket 7, which was backward compatible with older Socket 7 motherboards. It was manufactured using a 0.25 micrometre process, ran at 2.2 volts, and had 9.3 million transistors.
Ball grid array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Mobile processor
A mobile processor is a microprocessor designed for mobile devices such as laptops, and cell phones. A CPU chip is designed for portable computers to run fanless, under 10 to 15W, which is cool enough without a fan. It is typically housed in a smaller chip package, but more importantly, in order to run cooler, it uses lower voltages than its desktop counterpart and has more sleep mode capability. A mobile processor can be throttled down to different power levels or sections of the chip can be turned off entirely when not in use.
WinChip
The WinChip series was a low-power Socket 7-based x86 processor designed by Centaur Technology and marketed by its parent company IDT. The design of the WinChip was quite different from other processors of the time. Instead of a large gate count and die area, IDT, using its experience from the RISC processor market, created a small and electrically efficient processor similar to the 80486, because of its single pipeline and in-order execution microarchitecture.
Silvermont
Silvermont is a microarchitecture for low-power Atom, Celeron and Pentium branded processors used in systems on a chip (SoCs) made by Intel. Silvermont forms the basis for a total of four SoC families: Merrifield and Moorefield - consumer SoCs intended for smartphones Bay Trail - consumer SoCs aimed at tablets, hybrid devices, netbooks, nettops, and embedded/automotive systems Avoton - SoCs for micro-servers and storage devices Rangeley - SoCs targeting network and communication infrastructure.