Three-Dimensional Computer Chips

This lecture introduces the C Mosaic project, aiming to create three-dimensional computer chips by combining existing technology with a three-dimensional architecture. The lecture discusses the challenges, benefits, and objectives of transitioning from two-dimensional to three-dimensional computer chips, focusing on increasing performance, reducing energy consumption, and solving wiring problems. The project also aims to achieve high thermal performance by implementing cooling channels and through silicon vias. Additionally, the lecture highlights the goal of training multi-talented PhD students specialized in 3D computer chip technology.