Lecture

Chip Packaging Process Flow: Major Steps

In course

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Description

This lecture covers the major steps involved in chip packaging, including wafer preparation, dicing, die attach, wire-bonding, solder plating, molding, lead trim/form, and marking. It also discusses the reasons for packaging silicon integrated circuits and the evolution of packaging technologies over time.

Official source

https://mediaspace.epfl.ch/media/0_9tbyw7av

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Ontological neighbourhood

Computer engineering

Hardware engineering: Microprocessors

Energy engineering

Energy storage: Topics in energy storage

Mechanical engineering

Thermal engineering: Air conditioning

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