Heterogeneous Integration: Smart Systems on Foil

This lecture covers the integration of silicon components on polymeric foils, focusing on hybrid printed electronics. Topics include techniques for assembling components, examples of integrated devices, challenges in flexible system design, and methods for smart sensing systems. The lecture also discusses the process flow for hybrid systems, challenges in transferring silicon components, and the use of electrically conductive adhesives. Various interconnection techniques, such as through foil vias and anisotropic conductive adhesive, are explored for foil-to-foil integration. The lecture concludes with discussions on finishing techniques for mechanical stability and protection, as well as a case study on a hybrid smart sensing RFID label.