Covers the fundamentals of analog CMOS integrated circuits, emphasizing transistor-level design principles and the historical impact of CMOS technology.
Explores the fabrication of thin film devices for BCI, covering interconnect resistance, microfabrication, encapsulation materials, and Parylene coatings.
Covers the process integration in semiconductor fabrication, including twin-well process, isolation methods, threshold voltage adjustment, and silicide formation.
Explores Professor Sakurai's vision for the future of ICT, emphasizing energy efficiency, biocompatibility electronics, and the intersection of technology with societal challenges and business opportunities.
