Lecture

Deep Reactive Ion Etching: High Aspect Ratio Structures

In course

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Description

This lecture covers the process of deep reactive ion etching using an inductively coupled plasma reactor, focusing on SF and C4F8 deposition, etch rates, and total etch time. It also discusses the Bosch process, selective dry etching, and the fabrication of high aspect ratio structures.

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Instructors (2)

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Official source

https://mediaspace.epfl.ch/media/0_yoas7r0e

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Ontological neighbourhood

Electrical engineering

Electromechanics: Microelectromechanical systems

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