Person
Mikhail Asiatici
This person is no longer with EPFL
Related publications (13)
Through Silicon Vias With Invar Metal Conductor for High-Temperature Applications
Mikhail Asiatici, Göran Stemme
Through silicon vias (TSVs) are key enablers of 3-D integration technologies which, by vertically stacking and interconnecting multiple chips, achieve higher performances, lower power, and a smaller footprint. Copper is the most commonly used conductor to ...
Institute of Electrical and Electronics Engineers2017Designing a Virtual Runtime for FPGA Accelerators in the Cloud
Paolo Ienne, Mikhail Asiatici, Nithin George
FPGAs can provide high performance and energy efficiency to many applications; therefore, they are attractive computing platforms in a cloud environment. However, FPGA application development requires extensive hardware design knowledge which significantly ...
Ieee2016Capacitive inertial sensing at high temperatures of up to 400 degrees C
Mikhail Asiatici, Göran Stemme
High-temperature-resistant inertial sensors are increasingly requested in a variety of fields such as aerospace, automotive and energy. Capacitive detection is especially suitable for sensing at high temperatures due to its low intrinsic temperature depend ...
Elsevier Science Sa2016